Chip Quik SMDAL50 Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (50g jar)
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Product details
| Management number | 209981495 | Release Date | 2026/04/02 | List Price | US$15.98 | Model Number | 209981495 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 50g jar. Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum. Specifications Alloy: Sn96.5/Ag3.5 Flux Type: Synthetic Water-Soluble Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60C+) or IPA) Metal Content: 75% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 221C (430F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
- Solder Paste
| Material | metal |
|---|---|
| Item Weight | 1.76 ounces |
| Part Number | SMDAL50 |
| Manufacturer | Chip Quik® |
| Item model number | SMDAL50 |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 1.97 x 1.97 x 1.34 inches |
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